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August 2000

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Subject:
From:
"Hollandsworth, Ron" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 4 Aug 2000 10:54:58 -0500
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Ryan:
Thank you for the info on Alpha Tin.  I will pass this on to the other
person following up on this with me and we will make sure we are ok.  We are
not using Immersion White Tin process yet, but would like to see if we can
put it in out "Tool Box" of processes that we could use when the time is
right.

My concern after reading your initial e:mail was that we didn't solder on
the affected pads on the edge/mounting holes, however we did solder onto the
RF connectors.  I think it may be something else than the tin problem,
however, better safe than sorry.

Thanks again for your help.  I appreciate it.
Ron Hollandsworth
Ops Task Leader AME Group
ITT A/CD
[log in to unmask]


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