Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 4 Aug 2000 12:41:20 +0300 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Paul
I'm against heat sealing polyethylene (PE) or any plasticised bag with PCBs or PCAs
inside. I made tests about 30-35 years ago and found that the heating was sufficient to
evaporate both the plasticisers and (in the case of pink bags) anti-static compounds.
These are both hygroscopic materials and will condense, albeit in small quantities, on
the contents. Low temperature (35°C, 95% RH) SIR tests will reveal the potential harm.
Above 50°, an SIR test may not reveal it, as the stuff may evaporate from the board
during the ramp-up.
In any case, what's the point of sealing PE which is as porous as a sieve, anyway?
At the time I did these tests, we were looking for a packing material for bare boards
(M/Ls) which was 'opaque' to all forms of external contaminants and exempt from
internal ones. We settled for tri-ply food bags with a very thin polypropylene layer on
the inside, Sendzimir-rolled aluminium foil outside that and a thicker polyethylene on
the outside, to give robustness to the other two layers. This would vacuum heat-seal
perfectly and keep the PCB solderable with just a Sealbrite coating on a specially
treated copper for five years. Nothing could get through the aluminium.
This doesn't answer your question, but may be of interest! :-)
Brian
Paul Klasek wrote:
> Dear Forum
>
> Would anybody have any good, bad & ugly tales of belt sealers :
> insert filled bag , slide into dual belt , let fly through sealing heated
> roller ,
>
> as comparing to timed solenoid clamped dual (bottom and top) heat strip
> press sealer ?
>
> Application is medical kit pouch, not sterilised .
>
> thanks a lot paul
>
> ##############################################################
> TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
> ##############################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
> the body:
> To subscribe: SUBSCRIBE TECHNET <your full name>
> To unsubscribe: SIGNOFF TECHNET
> ##############################################################
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
> information.
> If you need assistance - contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> ##############################################################
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################
|
|
|