What about pads for BGA?
We had a batch with solder tails on through holes on the wave soldering side, checked
it by passing it through the solder wave, the tails dissappeared without trace, a thing
we could check visually, and accepted the batch for production.
I think that if the tails are on the reflow side on pads hidden by the component, we
should be more cautious.  Maybe there will be solder balls under the component.Or...?
Gaby

Timothy Reeves wrote:

> Couldn't see the photo. I don't think the LISTSERV allows attachments to be
> sent to the TechNet.
> It doesn't sound to me like something that should be rejected, as long as
> minimum spacing requirements are met.
>
> Timothy Reeves
> QA Manager/Process Engineer
> ECD Circuit Board Division
> 13626 S. Freeman Road
> Mulino, OR 97042
> (800) 228-8198    Fax (503) 829-5482
>
> -----Original Message-----
> From: Leonovich, Mike E. [mailto:[log in to unmask]]
> Sent: Wednesday, August 02, 2000 11:41 AM
> Subject: HASL Defects.
>
> Hi,
>
> I've been trying to determine IPC specs for a particular Hot Air Solder
> Leveling "defect".  Below is a electronic photo of the defect.
>
>  <<...OLE_Obj...>>
>
> This "defect" is called a solder tail, and I'm trying to determine when it's
> actually a defect and why.
>
> I know that if the "tail" stretches and contacts another annular ring, then
> it's defective because of bridge or short.
>
> If the surface plane of the annular ring is compromised by the excessive
> solder at the base of the tail, then it's defective because the annular ring
> needs to have a smooth even surface for the assembly of the surface mount.
>
> Other than these issues, is there any other reason why this "tail" would be
> defective?  If the presence of the tail doesn't create an uneven surface for
> the annular ring, and if the tail doesn't contact any other features it
> should be acceptable, right?
>
> I appreciate whatever help you could give me.
>
> Thanks.
>
> Mike.
>
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