Hello, fellow travellers,


Our Company has several board designs which use a new bus interface chip packaged in a PBGA304.

We have been notified via an errata sheet that the part need to have a 5V connection to Vio instead of 3.3V.

Physically, the only site for this net is a short "dogbone" which connects the pad on the board to a via and the internal power plane.

We are considering wild thoughts, like could we design a "BGA transistion" which would remap the connection of that ball to another pad on the PWB.

Has anyone heard of such?

It would of course mean that we pass through reflow twice, or allow two substrates to have balls collapse at once. My left brain is fighting with my right brain about this, and it might settle things to hear it had been done.

Any suggestions?


cheers,


Jerry Cupples
Interphase Corporation
Dallas, TX USA

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