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August 2000

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Subject:
From:
Timothy Reeves <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 3 Aug 2000 10:59:35 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (63 lines)
Couldn't see the photo. I don't think the LISTSERV allows attachments to be
sent to the TechNet.
It doesn't sound to me like something that should be rejected, as long as
minimum spacing requirements are met.

Timothy Reeves
QA Manager/Process Engineer
ECD Circuit Board Division
13626 S. Freeman Road
Mulino, OR 97042
(800) 228-8198    Fax (503) 829-5482


-----Original Message-----
From: Leonovich, Mike E. [mailto:[log in to unmask]]
Sent: Wednesday, August 02, 2000 11:41 AM
Subject: HASL Defects.


Hi,

I've been trying to determine IPC specs for a particular Hot Air Solder
Leveling "defect".  Below is a electronic photo of the defect.



 <<...OLE_Obj...>>

This "defect" is called a solder tail, and I'm trying to determine when it's
actually a defect and why.

I know that if the "tail" stretches and contacts another annular ring, then
it's defective because of bridge or short.

If the surface plane of the annular ring is compromised by the excessive
solder at the base of the tail, then it's defective because the annular ring
needs to have a smooth even surface for the assembly of the surface mount.

Other than these issues, is there any other reason why this "tail" would be
defective?  If the presence of the tail doesn't create an uneven surface for
the annular ring, and if the tail doesn't contact any other features it
should be acceptable, right?

I appreciate whatever help you could give me.

Thanks.

Mike.

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