Hi,

We have a customer who has a board with 20 mil pitch QFP's on it.  The
actual pad size is 11.8 mils wide and there is a 2 mil gap in the soldermask
around the pads leaving 4.2 mils of solder mask between the pads.  The board
house that is building these says they can't maintain the soldermask between
the pads and is asking for a window around all leads in the group or a
tightening of the soldermask openings around the pads.  Before I go to our
customer with this, I'd like to get some feedback on whether or not this is
unreasonable?  Are these dimensions acheivable or should I ask our customer
for a deviation?

Thanks in advance,


Rick Thompson
Ventura Electronics Assembly
2665A Park Center Dr.
Simi Valley, CA 93065

+1 (805) 584-9858 voice
+1 (805) 584-1529 fax
[log in to unmask]

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