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August 2000

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Subject:
Re: High Temperature PBA
From:
Craig Hillman <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Thu, 31 Aug 2000 19:13:17 -0400
Content-Type:
text/plain
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text/plain (109 lines) 
Phil,

        I hate to rebuke a TechNetter, but you should be worried about
the use of eutectic solder at 100oC. While the compliance is
greater, the damage due to creep is greatly magnified at this
temperature. In addition, growth of intermetallics will also be greatly
accelerated, possibly leading to failures not seen in cooler environs.

Craig


On 31 Aug 00, at 15:32, Tong Long Zhang wrote:

> Phil,
>
> You don't need to worry about stength of solder when board is at 100
> deg C. Actually the stress due to thermal mismatch is lower when the
> board is at 100 deg C than when it is at room temperature.
>
> TL
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Phil Dutton
> Sent: Wednesday, August 30, 2000 10:16 PM
> To: [log in to unmask]
> Subject: [TN] High Temperature PBA
>
>
> Hello Technetters,
>
> We are designing a Printed Board Assembly that will be required to
> operate in an ambient temperature up to 100 degrees Centigrade. There
> have been concerns expressed about the strength of solder joints at
> that temperature. Could anyone share any of their experiences using
> conventional solders and FR4 materials for similar applications. (this
> is not aerospace stuff, just gets very hot when it is working in a
> warm location.) Would standard solder pastes be satisfactory for this
> application, or are there any suggestions for the use of a higher
> temperature solder. Also, would the high temp solders present a
> problem for the assembly shops?
>
> regards,
>
> Phil.
>
>
>
> Phil Dutton C.I.D.
> Senior CAD Technician
> IPC Certified Interconnect Designer
>
> Tenix Defence Systems Pty Ltd
> Systems Division - Adelaide
> Second Avenue, Technology Park,
> Mawson Lakes.  SOUTH AUSTRALIA  5095
>
> ================================
> Phone: (08) 8300 4400 (reception)
> Fax:           (08) 8349 7420
> email:          [log in to unmask]
> Internet Page:  http://www.tenix.com
> ================================
>
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Dr. Craig Hillman
CALCE Electronic Products and Systems Consortium
University of Maryland
College Park, MD  20742
(301)-405-5316
[log in to unmask]

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