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August 2000

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Subject:
From:
Ryan Grant <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 30 Aug 2000 14:50:26 -0600
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Walter,
        The tin coating will be several thousandth of an inch thick and dome
shaped if you don't blow the molten solder off at the wave.
        Assuming you use an airknife cranked up super high to level the
pads, and if you intend to use the board immediately, you can probably level
the pads down to less than a tenth of thousandth of an inch thick.
        Seems like a strange thing to do.  Why don't you use HASL or
immersion Tin?

Thanks

Ryan Grant
Advanced Technology Engineer
MCMS
(208) 898-1145
[log in to unmask]



> -----Original Message-----
> From: Horaud, Walter [SMTP:[log in to unmask]]
> Sent: Wednesday, August 30, 2000 9:51 AM
> To:   [log in to unmask]
> Subject:      [TN] Coating with tin by wave soldering ?
>
> For the thermosoldering, the pads need to be coated with tin. In our case
> the coating must be as thin as possible.
> I was wondering if this step could be done by wave soldering.
> Does anybody know the average thickness of tin on the pads of a Ni/Au
> finishing board (without components) after wave soldering ?
>
> Thanks for helping,
>
> Walter.
>
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