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Date: | Wed, 30 Aug 2000 14:47:15 EDT |
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IPC Works is here.
Plating Subcommittee 4-14 will be getting together from 1:30 to 3:00pm on
Monday the 11th of September.
Our charter remains unchanged, we are in the process of writing a Standard
for Electroless Nickel, Immersion Gold and Electroless Gold will follow
immediately thereafter.
Our agenda in this meeting is to define the components of the "Standard" what
are we going to address, examples are:
Electroless Nickel:
Define the deposit characteristics (diffusion barrier, morphology, thickness
,etc) whether with Phosphorous or with Boron.
The required performance criteria (aging) as they relate to (I)soldering,
(ii) wire bonding and (iii)contact resistance.
Identify all relevant existing Standards and align the new Standard to them.
Immersion Gold:
Define thickness requirements, purity and cleanliness.
Define performance criteria and relevant Standards.
Electroless Gold:
Define thickness requirements, purity and cleanliness.
Define performance criteria (Gold wire bonding) and relevant Standards.
This task is long overdue. Please come prepared to discuss the above issues.
If you cannot attend but have input e-mail me and I will represent your
views to the group.
George Milad
(516)868-8800 X269
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