Hi ya'll!

Just wanted to let you all know that things were resolved about this issue
this afternoon. There was a conference call between us and our customer.
Prior to that, I called Anaren to find out the actual solder requirements for
this part in order for it to function as advertised.

There does not need to be a continuous fillet around the body of the part, in
fact, the engineer that I spoke with acknowledged that a continuous fillet
around the body would be very difficult because of the exposed copper on the
edges, that's just how the part is made (RF stuff ya' know...I didn't want to
get into it...). They did say that a solder bond beneath the body was good,
and as long as the grounding castellations exhibited good wetting you should
be fine.

The conference call went well. The customer backed-off from the side fillet
issues because of the pictures I sent them (the same ones you guys looked at)
and the issues I had with trying to achieve a side fillet at the locations
they were talking about. I also told them about the call I made to engineers
at Anaren and what they had told me.

So what resulted was that we were to continue to build product and ship, that
our DTS (Dock-To-Stock) status was still in effect, and that they were going
to spell out specific soldering requirements for that device on the drawing...

Sometimes it does help when you stand-up and say BULLS**T!! The customer is
always right most of the time, but not always....

One small victory today...they're so few and far between though...

Been a long day...hell, they're all long.

-Steve Gregory-

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