What are the requirements for a proper solder joint design for a 1 mm pitch
PBGA.?
(Package ball land is 0.018" dia;  ball dia is 0.026"; placed on a mixed
technology board)

I've been told to:

use an equivalent 0.018" dia pad on the PWB.

solder paste stencil would have 0.018" aperature dia,

aperature wall will be tapered 0.001" total,

Stencil thickness = 0.006"

Is this industry std?

R Kubes
Honeywell

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