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August 2000

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Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 29 Aug 2000 15:32:35 EDT
Content-Type:
text/plain
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In a message dated 08/29/2000 1:16:08 PM Central Daylight Time,
[log in to unmask] writes:

> Well, I have seen some interesting problems before... I wonder if you could
>  show us a component mounted to give us an idea of what the customer is
>  objecting to...
>  I have solved some of these problems using "solder dams", a thin line of
>  soldermask to prevent solder thieving from the close vias...
>  It would help though to see what the actual problem is... it's hard to
>  visualize.
>
>  Bill Brooks

Hi Bill!!

Picture is up, it's called Hybrid.jpg...go to:

http://www.driveway.com/share?sid=e25a88c4.8e904&name=Pictures

What is being objected to is that there is little, or no solder fillet where
I've indicated in the picture. The RF castellations are filleted, and there
is a teeny fillet in the ground castellation, but no filleting along the
horizontal edges on the ground pad.

The part is placed on top of solderpaste (you can see the paste print in the
other picture here), and the bottom of the component body is soldered
directly on the gounding pad. But with all the via's and the exposed copper
along the edges, there's not a snowballs chance I'll ever get decent fillets
where they say they want them.
I can hand add them for a price, but I don't think it should be
necessary...but hey, I'm not an RF guy...

-Steve Gregory-

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