TECHNET Archives

August 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Marsico, James" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 29 Aug 2000 13:07:43 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (100 lines)
Steve, you're right that 610 doesn't address this issue.   We use this type
of device quite often, and to operate properly (RF stuff, you know...) the
entire body of the component must be soldered down, with a nice fillet all
around.  This requirement should be documented on the drawing, however.  
Thanks,
Jim M.


        -----Original Message-----
        From:   Stephen R. Gregory [SMTP:[log in to unmask]]
        Sent:   Tuesday, August 29, 2000 10:21 AM
        To:     [log in to unmask]
        Subject:        [TN] Castellated Hybrid soldering...

        Mornin' all!!

        Notice I didn't say "Good" mornin'...mine is started off as
usual...SNAFU. We 
        build this RF board here that has what's called a 90° Hybrid
Coupler. It's 
        from a company called Anaren and it's trade named a ZingerŪ.
Basically it's a 
        surface mount metal bodied ceramic filled part that gets its body
soldered to 
        one big via filled pad that connects to a ground plane, and then
there are 
        four castellations at each corner (which are the RF pads of the
device) that 
        are soldered to very wide traces. 

        Well, we've been told that we're getting boards back because the
soldering 
        doesn't meet -610 class 2, and that there should be a continuous
fillet 
        completely around the portion of the body of the part that is
connecting to 
        the ground plane.
        I say there isn't anything in the -610 that applies to that.

        I've got some pictures up so you can see what I mean. Go to: 

        http://www.driveway.com/share?sid=4eced0a4.94f42&name=Pictures

        There's a picture called Pasteprint.jpg that shows the footprint on
the 
        board, you'll see the big grounding pad in the center, and the four
corner 
        pads where the RF pads of the device connect to. The other picture
is called 
        bubblyplating.jpg and is a close-up of one of the castellations that
have 
        this bubbly looking plating on them...anybody ever seen that before?
The 
        other picture is called exposedcopper.jpg and is a side view of the
device 
        that shows exposed copper along the edges of the device...and that's
where 
        they say we don't meet IPC spec's, they say we should have a
continuous 
        fillet all along those edges. I don't have a problem meeting their
spec's if 
        that's what's required for the board, but I do have a problem when
they say 
        it doesn't meet IPC spec's, because this is such a weird part and
weird 
        footprint, I don't believe the -610 addresses it.

        -Steve Gregory-

        ##############################################################
        TechNet Mail List provided as a free service by IPC using LISTSERV
1.8c
        ##############################################################
        To subscribe/unsubscribe, send a message to [log in to unmask] with
following text in
        the body:
        To subscribe:   SUBSCRIBE TECHNET <your full name>
        To unsubscribe:   SIGNOFF TECHNET
        ##############################################################
        Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
additional
        information.
        If you need assistance - contact Keach Sasamori at [log in to unmask] or
        847-509-9700 ext.5315
        ##############################################################

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2