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August 2000

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Subject:
From:
"Dieselberg, Ron" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 29 Aug 2000 10:57:28 -0400
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Steve, I looked at the PIX and that is some ugly stuff!
I have only one question. What does the drawing say about the soldering and
acceptability? IMHO if it ain't spelled out on the drawing they shouldn't be
holding your feet to the fire 'cause I don't find anything like that in 610
either.
Ron Dieselberg
BAE SYSTEMS
Cincinnati Electronics Corp.

-----Original Message-----
From: Stephen R. Gregory [mailto:[log in to unmask]]
Sent: Tuesday, August 29, 2000 10:21
To: [log in to unmask]
Subject: [TN] Castellated Hybrid soldering...


Mornin' all!!

Notice I didn't say "Good" mornin'...mine is started off as usual...SNAFU.
We 
build this RF board here that has what's called a 90° Hybrid Coupler. It's 
from a company called Anaren and it's trade named a ZingerŪ. Basically it's
a 
surface mount metal bodied ceramic filled part that gets its body soldered
to 
one big via filled pad that connects to a ground plane, and then there are 
four castellations at each corner (which are the RF pads of the device) that

are soldered to very wide traces. 

Well, we've been told that we're getting boards back because the soldering 
doesn't meet -610 class 2, and that there should be a continuous fillet 
completely around the portion of the body of the part that is connecting to 
the ground plane.
I say there isn't anything in the -610 that applies to that.

I've got some pictures up so you can see what I mean. Go to: 

http://www.driveway.com/share?sid=4eced0a4.94f42&name=Pictures

There's a picture called Pasteprint.jpg that shows the footprint on the 
board, you'll see the big grounding pad in the center, and the four corner 
pads where the RF pads of the device connect to. The other picture is called

bubblyplating.jpg and is a close-up of one of the castellations that have 
this bubbly looking plating on them...anybody ever seen that before? The 
other picture is called exposedcopper.jpg and is a side view of the device 
that shows exposed copper along the edges of the device...and that's where 
they say we don't meet IPC spec's, they say we should have a continuous 
fillet all along those edges. I don't have a problem meeting their spec's if

that's what's required for the board, but I do have a problem when they say 
it doesn't meet IPC spec's, because this is such a weird part and weird 
footprint, I don't believe the -610 addresses it.

-Steve Gregory-

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