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August 2000

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Subject:
From:
Ryan Grant <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 28 Aug 2000 13:11:23 -0600
Content-Type:
text/plain
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text/plain (73 lines)
Franklin,
        Did the customer use an intrusive soldering process?  (i.e., solder
paste is pushed into the through hole to provide the solder.  Intrusive
soldering causes voids and is considered normal.)

Thanks

Ryan Grant
Advanced Technology Engineer
MCMS
(208) 898-1145
[log in to unmask]

> -----Original Message-----
> From: Franklin D Asbell [SMTP:[log in to unmask]]
> Sent: Monday, August 28, 2000 8:38 AM
> To:   [log in to unmask]
> Subject:      [TN] Bubbles in through holes
>
> Help...
>
> A customer has brought a problem to our attention. The yare experiencing
> 'air bubbles' in through holes after wave soldering.
>
> The copper plating in the hole is averaging 1.25 mils, we have not seen
> any compromised hole walls, only bubbles, they even extend up and out of
> the hole next to the component leads.
>
> I have uploaded pictures on our website, any assistance would be
> appreciated.
>
> These boards were fabricated here in Texas 13 months ago, the customer
> did not bake the boards prior to processing. Thanks
>
>
> You can view these pictures at this link:
> http://www.networkcircuits.com/technical.htm
>
>
> Franklin D Asbell
> Network Circuits, Inc.
> Irving, Texas 75061
>
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