We used the same flux we use for our HASL process, which would be the
same used to HASL them originally, a year ago (not to be confused with
the same flux from a year ago)
Thanks,
Franklin
Alain Savard wrote:
>
> Did you use the same flux as your client?
>
> Alain Savard, B.Sc.
> Chemical Process Analyst
> CAE Electronics Ltd.
> e-mail: [log in to unmask]
>
> -----Original Message-----
> From: Franklin D Asbell [mailto:[log in to unmask]]
> Sent: August 28, 2000 11:58 AM
> To: [log in to unmask]
> Subject: Re: [TN] Bubbles in through holes
>
> Contamination either of the bare board itself, or the component leads
> was something we considered. I took one of the bare boards and
> contaminated it with dust, dirt, and oil from outside our wet process
> area and then floated the board in solder...it actually soldered very
> good. In fact, none of the boards we soldered in our lab exhibited the
> condition, only the boards soldered at our customers facility. This
> included populated and bare boards for what it's worth.
>
> Appreciate the comments,
>
> Franklin
>
> Alain Savard wrote:
> >
> > I agree with Brian on this one. We usually require baking on boards more
> > then 6 to 8 months old. The FR-4 will have absorbed sufficient moisture in
> > the (im)proper storage condition.
> > Also verify for contamination on the components leads.
> >
> > Alain Savard, B.Sc.
> > Chemical Process Analyst
> > CAE Electronics Ltd.
> > e-mail: [log in to unmask]
> >
> > -----Original Message-----
> > From: Brian Ellis [mailto:[log in to unmask]]
> > Sent: August 28, 2000 11:01 AM
> > To: [log in to unmask]
> > Subject: Re: [TN] Bubbles in through holes
> >
> > Franklin
> >
> > Rarely have I seen such an example of blowholing! You should patent your
> > process for
> > reducing the amount of lead in an assembly :-). Your board has simply
> > absorbed a lot of
> > moisture. A prebake will mitigate the problem, but prevention is better
> than
> > cure.
> >
> > Brian
> >
> > Franklin D Asbell wrote:
> >
> > > Help...
> > >
> > > A customer has brought a problem to our attention. The yare experiencing
> > > 'air bubbles' in through holes after wave soldering.
> > >
> > > The copper plating in the hole is averaging 1.25 mils, we have not seen
> > > any compromised hole walls, only bubbles, they even extend up and out of
> > > the hole next to the component leads.
> > >
> > > I have uploaded pictures on our website, any assistance would be
> > > appreciated.
> > >
> > > These boards were fabricated here in Texas 13 months ago, the customer
> > > did not bake the boards prior to processing. Thanks
> > >
> > > You can view these pictures at this link:
> > > http://www.networkcircuits.com/technical.htm
> > >
> > > Franklin D Asbell
> > > Network Circuits, Inc.
> > > Irving, Texas 75061
>
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