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August 2000

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 28 Aug 2000 18:00:30 +0300
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Franklin

Rarely have I seen such an example of blowholing! You should patent your process for
reducing the amount of lead in an assembly :-). Your board has simply absorbed a lot of
moisture. A prebake will mitigate the problem, but prevention is better than cure.

Brian

Franklin D Asbell wrote:

> Help...
>
> A customer has brought a problem to our attention. The yare experiencing
> 'air bubbles' in through holes after wave soldering.
>
> The copper plating in the hole is averaging 1.25 mils, we have not seen
> any compromised hole walls, only bubbles, they even extend up and out of
> the hole next to the component leads.
>
> I have uploaded pictures on our website, any assistance would be
> appreciated.
>
> These boards were fabricated here in Texas 13 months ago, the customer
> did not bake the boards prior to processing. Thanks
>
> You can view these pictures at this link:
> http://www.networkcircuits.com/technical.htm
>
> Franklin D Asbell
> Network Circuits, Inc.
> Irving, Texas 75061
>
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