Board shops sometimes use peelables also.  They can be used in hot
air solder level to keep solder off certain areas (ie gold contacts).
They can also be used in selective plating areas (ie. to protect gold
electroplated areas during electroless gold plating).

The choices are slightly more limited.  For example the liquid
strippable versions don't work in plating applications and
even the thermally cured versions tend to move around when they are
hit with the air at hot air level.

Perhaps the greatest problem is getting complete removal.  There is often
a dotted line of residual mask around the perimeter of the peeleed area
and often peelable is left in via holes.  An end user might accept some
non-conductive green stuff left in via holes.  On the other hand, incoming
inspection departments at assembly often don't like stuff in plated holes
that can trap flux & stuff later.

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