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August 2000

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Subject:
From:
"Barmuta, Mike" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 25 Aug 2000 07:38:14 -0700
Content-Type:
text/plain
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text/plain (72 lines)
The primary function is to prevent solder deposition to preselected sites
during the machine(wave)soldering operation.
These areas can be discrete components that require post hand soldering,
dimensional tolerance locations that can not have solder build up, hardware
sites; selective plated areas like gold key pads, connectors, switches etc.
It can also be used for such things as component tack down and as a
containment barrier to prevent solder from running to adjacent areas.

Regards

Michael Barmuta

Staff Engineer

Fluke Corp.

Everett WA

425-356-6076


-----Original Message-----
From: S. Miller [mailto:[log in to unmask]]
Sent: Thursday, August 24, 2000 9:39 PM
To: [log in to unmask]
Subject: [TN] Functional Intent of Peelable Soldermask


To All,

I have been introduced to several projects in Europe, all requiring the
application of peelable soldermask.

Given that this is a disposable process (peelable soldermask is removed
after
PCBA), why bother with it at all?

What function does it serve?  Is really required?

Any and all feedback on this issue would be truly appreciated.

Regards,

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