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August 2000

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Subject:
From:
Ken Fong <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 24 Aug 2000 10:36:16 +0800
Content-Type:
text/plain
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text/plain (29 lines)
Dear Technetters,

D2pak is the surface mount counterpart of the through hole TO220. Does anyone
know how the surface mount leads of the D2pak package are form from the straight
leads in the original leadframe? The most crucial thing is how the leads can be
clamped to prevent the die inside from being stressed during forming? There's an
issue that the three leads may not be coplanar, thus clamping them will also
cause stress to the die inside. But if not being clamped, the force for lead
cutting and forming may also damage the die. It's a dilemma!

Any advise or reference quoted will be highly appreciated.

Regards,
KenF, Aug 24,00

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