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August 2000

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Subject:
From:
Hinners Hans Civ WRALC/LYPME <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 21 Aug 2000 16:32:22 -0400
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Hi Michael,

We use TempSeal DA on assemblies prior to wave flow soldering.
We cover hardware, fill in holes and tack down packages known to float.

The down side time: application and drying and removal afterwards. We've
thought of looking into a water soluble mask that will get washed off when
we clean the assemblies.

I'm also looking into pallet templates to eliminate the masking operation
all together, on at least one assembly.

Hans

~~~~~~~~~~~~~~~~~~~
Hans M. Hinners
Materials Engineer (Process & Manufacturing)
Warner Robins Air Logistics Center
Avionics Production Division
Manufacturing Branch
380 Second Street, Suite 104
Building: 640, Mail Stop: LYPME
Robins AFB, GA 31098-1638
Voice: (478) 926 - 1970 Fax: (478) 926 - 7164
mailto:[log in to unmask]
http://www.robins.af.mil



-----Original Message-----
From: Michael Lester [mailto:[log in to unmask]]
Sent: Monday, August 21, 2000 2:41 PM
To: [log in to unmask]
Subject: [TN] Peelable SolderMask


Any manufacturers in here have experience with peelable mask? Only the good
points are ever discussed in the sales brochures. I'm looking for the evil
side. It seems to go against everything I've ever tried to accomplish with a
solder mask and it makes me a little nuts to think a customer wants to undo
what we try so hard to do! I'm afraid next they'll want removable
traces.....Any thoughts or comments appreciated.

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