Thanks to everyone who commented on my question yesterday "LGX file
extension". Today I have another one.

For the past 10 -12 months since incorporating the IPC-4101 Specification
for Base Materials for Rigid and Multilayer Printed Boards and implementing
Immersion White Tin as our surface finish and looking toward using
99.3Sn/0.7Cu for our wave soldering & 95.5Sn/4.0Ag/0.5Cu or 96.5Sn/3.5Ag
for our Reflow soldering I have been specifying the slash sheet 24 (Tg
150°C - 200°C) as our base laminate. The reason was to get a higher Tg
material in order to withstand the higher manufacturing process
temperatures (wave & reflow soldering). This is now in danger due to cost
reduction programs being looked at internally. Typically in the past what
we called out was a generic form of FR-4 and what we got was similar to
slash sheet 21 (tg 110°C Minimum).

I'm in the process of calculating just what the material cost differences
from our vendors is but wanted to put this out to the other industry
experts also.

Now for my questions, are any of those people looking at the "Lead-Free"
going through similar experiences. Was my concern for the higher temps in
manufacturing realistic. Was my approach realistic.


Sorry if this sounds pleading but with the changes around here I'm
concerned whether my ideas hold credibility or not.

Thanks in advance for any comments.

Steve
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