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Subject:
From:
William Plumbridge <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 18 Aug 2000 11:19:31 +0100
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                        Structural Integrity of Electronic Devices


With continued miniaturisation and the advent of Surface Mount Technology,
the requirement for mechanical structural integrity of electronic devices
is becoming increasingly important. It is essential to demonstrate
reliability in performance.
While empirical thermal cycling of boards has its place in the short term,
the results are highly specfic to particular board configurations and
temperature profiles.
The real goal is to be able to design boards, which meet their performance
requirements, from the outset, and so eliminate the costly and time
consuming testing. This task is equivalent to, and just as challenging as
any in high temperarure structural design, such as power generation or
aerospace. It would best be undertaken in a spirit of global collaboration.

Through the auspices of The European Structural Integrity Society  (
ESIS), I would like to establish a Subcommittee of that organisation to
focus upon this problem specifically. I firmly believe that two major
benefits would result

1. Greater cohesion amongst the workers already active in the field who
are thinly spread throughout Europe, and

2. Attraction of other experts in structural integrity who might cross
fertilise and simulate applications in the electronics arena.


My tentative defintion of structural integrity in this context includes
Mechanical behaviour - tensile, shear, creep , fatigue, thermal fatigue,
thermomechanical fatigue.
Microstrucural effects -  coarsening, voiding, cracking etc
Analysis - modelling of these events. FEA, constitutive equations,
Design and life prediction.
In fact, anything that relates to monitoring, modelling and predicting
performance.


I would be very pleased to hear from anyone interested in such an
activity. Personally, I believe that it is highly appropriate that the
electronics community should take steps now to anticipate this growing
challenge and tackle it more profesionally.

Please contact me if you would like to be involve or you have any queries.

Bill Plumbridge

( Professor of Materials Engineering, The Open University, UK )

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