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August 2000

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 18 Aug 2000 12:54:11 +0300
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Mike,

Please, just send your text normally.

I would be very cautious about conformally coating over "no-clean" flux
residues. You will certainly have hygroscopic and ionic contaminants,
including metal salts, even assuming your board and components were
perfectly clean before soldering. If these are simply coated and sealed
over, I reckon you would be open to a good dose of vesication or worse,
as soon as the sun shone on your box and there was a little moisture
trapped inside to raise the humidity.

Do you have a neighbouring company to which you could sub-contract your
cleaning?

That having been said, I know a company that is soldering with a
"no-clean" adipic acid flux and is using a coating that uses adipic acid
for cross-linking. This is, IMHO, only a very partial solution because
there can be no stoichiometry in the cross-linking reaction, it assumes
the residues are homogeneously dissolved in the coating and it takes no
care of the highly ionic metal salt question.

Brian

Mike Lang wrote:

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