few tricks may help:
(1) use Lonco flux to activated your PWB before wave (Lonco=pink water
soluable flux can eat your forks for lunch).  Make sure you clean the PWB on
time with the neutralizer and hot water....
(2) as suggested by others, bake and wave immediately.

A lot of problem with the old design is that process changed in late 80s:
(1) eliminate CFC ==> can not use RA flux
(2) cost cutting ===> use FR4 instead of polyimide board ==> can not go high
temperature wave
(3) cost cutting ===> use non-mil temp range components ===> can not go to
high temperature wave
(4) cost cutting ==> use non-nitrogen or low grade nitrogen and/or shorter
preheat zone (cycle time improvement)...
(5) others...(you want to know? no, no, you do not really want to know...).
It is sad you find out on production line...someone (designer) should spot
it...(back to Brain's point of concurrent engineering...with the fast turn
around workforce...you may have difficult time to "concurrent"...copycat
without true knowledge is scary in design...)...(i think i better shut up
before someone kills me)...
                                      jk
At 10:20 AM 8/16/00 EDT, you wrote:
>In a message dated 08/16/2000 8:44:10 AM Central Daylight Time,
>[log in to unmask] writes:
>
>> We usually wave solder the easy components, clean, apply the heat sinks,
>>  clean again, bake, and hand solder the toughies.  Would a rework station be
>>  any help?  That's a guess, we're looking at getting a mini-wave system next
>>  fiscal.
>>
>>  How ancient - 70's, 80's, or early 90's?
>>
>>  Hans
>
>Hi Hans!
>
>Wish I could that, but the heatsinks are bonded to the top of the boards and
>cover the entire surface of the board, except where the barrels are for the
>components. Then you install the components straddling the heatsink...they
>don't make it easy brother!
>
>-Steve Gregory-
>
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