Hello Jerry,

What you are describing can be done easily following
procedures found in IPC-7721, Repair and modification
of printed boards and electronic assembly.  You can
find specific BGA site modification procedures in the
latest revision of Circuit Technology Center's
comprehensive rework and repair guidebook.

www.circuittechctr.com/services/bga.htm

This page describes the process.

Feel free to contact me offline if you have specific
questions on application or process development.

Mike Connolly
Circuit Technology Center

--- Jerry Cupples <[log in to unmask]> wrote:
> Hello, fellow travellers,
>
>
> Our Company has several board designs which use a
> new bus interface chip packaged in a PBGA304.
>
> We have been notified via an errata sheet that the
> part need to have a 5V connection to Vio instead of
> 3.3V.
>
> Physically, the only site for this net is a short
> "dogbone" which connects the pad on the board to a
> via and the internal power plane.
>
> We are considering wild thoughts, like could we
> design a "BGA transistion" which would remap the
> connection of that ball to another pad on the PWB.
>
> Has anyone heard of such?
>
> It would of course mean that we pass through reflow
> twice, or allow two substrates to have balls
> collapse at once. My left brain is fighting with my
> right brain about this, and it might settle things
> to hear it had been done.
>
> Any suggestions?
>
>
> cheers,
>
>
> Jerry Cupples
> Interphase Corporation
> Dallas, TX USA
>
>
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