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August 2000

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Subject:
From:
"Smith, Gary" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 14 Aug 2000 15:07:33 -0400
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Referencing Ray Prassad's text on SMT, pp 134-135

".....Co-planarity allowed by JEDEC standard (MO 151) is 0.006 inch for
smaller BGA's (1 mm pitch) and 0.008 inches for larger BGA's (1.27 mm and
1.5 mm)...."




-----Original Message-----
From: Alex L Chan [mailto:[log in to unmask]]
Sent: Monday, August 14, 2000 2:41 PM
To: [log in to unmask]
Subject: [TN] Looking for standard on component bowing?


Hi Technetters,

Is there anyone know there is any standard for component bowing?  For
example, for PWB there is standard for how much bow per inch.  Is there
any standard for the same purpose but is for component after reflow,
such as connectors, BGA, etc.

Thanks in advance,
Alex

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