Thomas,

At 07:29 PM 8/13/00 +0200, you wrote:
>    Dear Technetters,   we are currently investigating non-woven aramide
>reinforced PI  (Poly-Imide) materials for multilayer PWB fabrication. Our
>requirement is light  weight and high temperature (150 deg C = 300 deg F)
>environment, further low TCE  to reduce thermal expansion mismatch to large
>ceramic components.   Formerly we have used metal core multilayer boards,
>but now we  need to save weight. Who can give us advice on material
>selection or share  experience with manufacturing (selection of core and
>prepreg material) and  durability at this high use temperature?   Any help
>will be appreciated   Best regards,   Thomas Ahrens [log in to unmask]

A.E.A. Technology have been working on SiC/Al metal matrix composites for
use as cores in PCBs. These have much lower density than other composite
core materials such as Cu/Invar/Cu, whilst also having low expansion and
high thermal conductivity.

David Whalley

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