Rick,

We spec the following:

For Polyimide-glass boards or Polyimide based Flexible Circuits:
        105 +/- 5degC for minimum 1hour / maximum 2hours, or
        80 +/- 5degC for minimum 12hours / maximum 80hours.

For Polyimide based multilayer Flexi-rigids or Aramid Fibre based
boards:
        105 +/- 5degC for minimum 24hour / maximum 48hours, or
        80 +/- 5degC for minimum 72hours / maximum 168hours.

All soldering operations completed in 12hours.

Would be interesting to see how this compares with others...

Hope it helps,

Clive ffitch
MBUK
Stevenage, England


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]
Sent: 09 August 2000 19:29
To: [log in to unmask]
Cc: [log in to unmask]
Subject: [TN] Baking Bare PCB's?


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I'm trying to establish some basic guidelines for the baking of bare
PCB's
that have potentially absorbed moisture due to unknown storage
conditions
and time.  Are there any industry guidelines for this type of process or
would someone mind sharing their general procedures?  I thought I had
read
somewhere about times in the 2-8 hour range at 125 C but can't find that
information anywhere.

Thanks in advance.

Rick Thompson
Ventura Electronics Assembly
2665A Park Center Dr.
Simi Valley, CA 93065

+1 (805) 584-9858 voice
+1 (805) 584-1529 fax
[log in to unmask]

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