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August 2000

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Subject:
From:
Paul Klasek <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 11 Aug 2000 11:04:27 +1000
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text/plain
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text/plain (95 lines)
hahaha, burned the flux before hitting wave ,
oh god, i should not laugh,
but it's always so funny when cad guys hit the jungle .

Yep, the speed/heat/surface/sink cards are exactly reversed;

told you, been there, as frustrated as you,
than picked my bud from behind classy 21" monitor
and dragged him over the working man's reality above wave,
with elementary physics verbals.

Welcome to paradox domino club (sort of naked poets society).

pk

made my Friday Steve, thx , have a cool wknd,
hohoho, this hurts...

used to be good days in subs,
this OEM stuff is soo boring.
Envy yo' (almost)


-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Friday, 11 August 2000 10:14
To: Paul Klasek; [log in to unmask]
Subject: Re: [TN] Topside solder fillets after wave...


In a message dated 8/10/00 6:05:01 PM EST, [log in to unmask] writes:

<< the second puzzle of physics of heating interrupted HIGH = LONG barrels
is
 simple .

 Almost regardless how slow you drive it (agree with Phil),
 the designer actually f...ed up :

 You DO need full contact (not a relief) to heat the >long< barrel and keep
 it hot with significant inside dissipations, learned that one on PS's.

 The high speed standard assembly and thick specials have non transferable
 sets of physics, ie horses for courses, = tractor is faster than ferrari in

places.
 One of the reasons why i hate standards = makes folks to asses with carrots
 to follow


 Enjoy yourself mate, no way out

 paul >>

Hey Mate!!

So you're saying that on thick boards, one should not themally relieve plane

connections? Interesting...kinda' makes sense now that I think about it, you

need a lot of preheat for sure on thick boards, but having thermals in large

planes will not allow the heat to not be retained in a long barrel unless
it's connected to the heat...hmmmm...

Phil brought up a facet about increasing solder temperature...I've done
everything else (slowing belt speed, increasing pre-heat temps) but that,
only resulting in exhausting the flux before hitting the wave..which is not
a
good thing...spikes, bridges, etc....so how much higher than 500-F should I
go? I'm also setting the wave depth that the board experiences when entering

the wave at the level where you could crack a walnut in between my
butt-cheeks when I'm watching a board go into the wave...in other words,
it's
d-e-e-e-p bro'!

I get the feeling that I'm grasping at straws...as you said; "No way out..."

-Steve Gregory-

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