In a message dated 8/10/00 10:24:21 AM EST, [log in to unmask] writes:

<< I have a problem with via's that have been masked over having trapped
solder in the via's after HASL.  The solder that is in the via's is surfacing
after we reflow the bottom side of the board.  I have not had this problem
before and wanted some advice from all of you.  I am sending this message
again due to the lack of response I got.  Any help or advice would be greatly
appreciated!
 Thank you,

 Scott Lefebvre
 [log in to unmask] <mailto:[log in to unmask]> >>

Hi Scott!

I had the same thing happen quite a while ago. With the boards that I had it
appeared that an attempt was made to tent the via's after HASL by applying
the mask only on the via's...why that was done I have no idea. The boards
were consigned to us by our customer. But just like you, we had these little
balls all over the board after they had squirted out during reflow...some of
them you could kinda' scrape off, but most were firmly attached to the anular
pad of the via. Bottom-line, the boards were scrapped...

Sorry, couldn't be of more help...

-Steve Gregory-

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################