Hi, Scott,

the idea of HASL is, after all, to blow PTH free from solder, why not do the
same with vias? The only advice I can think of is talk to your board
manufacturer. Ask to see high quality via microsections, maybe there is a
problem with too much copper or excessive hole roughness, which do not allow
the vias to be blown free.

Best regards,

Thomas Ahrens
[log in to unmask]

-----Ursprüngliche Nachricht-----
Von: Lefebvre, Scott <[log in to unmask]>
An: [log in to unmask] <[log in to unmask]>
Datum: Donnerstag, 10. August 2000 17:26
Betreff: [TN] Solder masked Via problems


>I have a problem with via's that have been masked over having trapped
solder in the via's after HASL.  The solder that is in the via's is
surfacing after we reflow the bottom side of the board.  I have not had this
problem before and wanted some advice from all of you.  I am sending this
message again due to the lack of response I got.  Any help or advice would
be greatly appreciated!
>Thank you,
>
>Scott Lefebvre
>[log in to unmask] <mailto:[log in to unmask]>
>
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