TECHNET Archives

August 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Mike Sewell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 10 Aug 2000 11:50:47 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (31 lines)
If baking is required, mandatory for polyimide or customer directed...

We bake at 125C for 3-4hrs then:

1.  process through automated soldering (wave or reflow) within 24 hours
2.  hand solder within 96 hrs
3.  place in a dry box until needed
4.  If time out of oven (not in dry box) exceeds req. 1 or 2 we rebake.

We follow the same time guidelines for usage for moisture sensitive parts but
bake per manufacturer's guidelines/moisture sensitivity indicated on the
packaging.  (example:  partial tray of QFPs comes in opened => questionable
moisture level => bake and place in dry box)

Regards,
Mike Sewell

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2