Scott,

With solder trapped in the via's the only way I'm aware of to remedy
that (immediate action) is stripping the solder off, then the mask off.
You should do both as just stripping solder may not remove it from the
areas deep in the via.

Now, to ensure it won't happen again...we would expose, develop and cure
each side of the panel independantly when we recognize vias in areas
where trapped solder may potentially cause our customers problems. Yes,
this can add a little time to the job, but we have been quite successful
when we take this time.

Hope this helps...

Franklin


"Lefebvre, Scott" wrote:
>
> I have a problem with via's that have been masked over having trapped solder in the via's after HASL.  The solder that is in the via's is surfacing after we reflow the bottom side of the board.  I have not had this problem before and wanted some advice from all of you.  I am sending this message again due to the lack of response I got.  Any help or advice would be greatly appreciated!
> Thank you,
>
> Scott Lefebvre
> [log in to unmask] <mailto:[log in to unmask]>
>
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