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August 2000

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Subject:
From:
"Spaulding, Stephen" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 9 Aug 2000 14:59:00 -0400
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Rick
A general procedure we used for years was as follows:
        Low Relative Humidity  59% and below
        115 degrees C +/-2 degrees C min 4hrs. max. 8hrs.

        High Relative Humidity 60% and above
        115 degrees C +/- 2 degrees C min. 6hrs. max. 8hrs

        Once removed from oven mus be assembled and soldered within 48 hrs..
Good luck
Steve Spaulding
Compaq Computer

-----Original Message-----
From: Rick Thompson [mailto:[log in to unmask]]
Sent: Wednesday, August 09, 2000 2:27 PM
To: [log in to unmask]
Subject: [TN] Baking Bare PCB's?


I'm trying to establish some basic guidelines for the baking of bare PCB's
that have potentially absorbed moisture due to unknown storage conditions
and time.  Are there any industry guidelines for this type of process or
would someone mind sharing their general procedures?  I thought I had read
somewhere about times in the 2-8 hour range at 125 C but can't find that
information anywhere.

Thanks in advance.

Rick Thompson
Ventura Electronics Assembly
2665A Park Center Dr.
Simi Valley, CA 93065

+1 (805) 584-9858 voice
+1 (805) 584-1529 fax
[log in to unmask]

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