TechNet Designers,

I was looking in IPC-SM-782 and IPC-D-279 and didn't find anything specific
on BGA pad guidelines.
I see in the IPC Technical Info book that there is an amendment 2 that
addresses BGA pad design.

While I am getting that amendment ordered, is there any standard "rule of
thumb" for pad size
relative to ball diameter on 1.27m and 1.0m BGA's that should be followed,
or that you have found to be
useful in designing boards with BGA devices?

Thanks for your help and opinions.

Regards....DT

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