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August 2000

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Subject:
From:
"Corbel, Gwenna" <[log in to unmask]>
Reply To:
Leadfree Electronics Assembly E-Mail Forum.
Date:
Mon, 28 Aug 2000 14:49:47 +0200
Content-Type:
text/plain
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text/plain (108 lines)
Erik, 

do you think this congress will really be interesting ? 

Gwenna Corbel 
Solectron

-----Message d'origine-----
De: <Erik de Kluizenaar> [mailto:[log in to unmask]]
Date: lundi 28 août 2000 14:08
À: [log in to unmask]
Objet: Re: [LF] Failure mechanism of Sn-Ag-Cu


Dear Mr Quadir, dear all,

Late reaction because of summer holiday. Sorry!

In the BRITE/EURAM project IDEALS we found the following degradation modes
for various alloys:
SnCu eutectic:  cell boundary fracture; virtually no intergranular
deformation
SnBiAg alloy:  ibid
SnAgCu eutectic: intergranular as well as cell boundary deformation,
comparable ti tin-lead eutectic.
More details will be presented during the second week of September in Europe
Goes Green - Berlin Germany and in IPCWorks 2000 in Miami.

Regards, Erik
----------------------------------------------------------------------------
------------------------------------------------------
Erik E. de Kluizenaar
Philips CFT - Electronic Packaging & Joining (EP&J)
Building SAQ-p,  p/o box 218,  5600 MD Eindhoven - The Netherlands
Tel/Fax: (+31 40 27) 36679/36815;    E:mail  [log in to unmask]
PHILIPS worldwide homepage:  http://www.philips.com
Internal PHILIPS only:
http://pww.cft.philips.com/cfteurope/electronics/elpajo/index.htm
----------------------------------------------------------------------------
-------------------------------------------------------





[log in to unmask]@[log in to unmask] on 2000/08/14 04:23:21 PM
Please respond to [log in to unmask]@SMTP 
Sent by:        [log in to unmask]
To:     [log in to unmask]@SMTP
cc:      
Subject:        [LF] Failure mechanism of Sn-Ag-Cu
Classification: Restricted
Hi All,

I was wondering if anybody on this list has worked on failure mechanism
of the above solder alloy due to thermal cycling. Some initial work done
in my institute suggest that SAC alloy has trans-granular failure and
not inter-granular failure as in Sn-Pb solder.
I hope somebody can confirm this result.

Thanks and Regards

Yasir Abdul Quadir
Ph.D. Student
NMRC, UCC
Cork, Ireland

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