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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 28 Aug 2000 11:22:53 -0400 |
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I agree with Brian on this one. We usually require baking on boards more
then 6 to 8 months old. The FR-4 will have absorbed sufficient moisture in
the (im)proper storage condition.
Also verify for contamination on the components leads.
Alain Savard, B.Sc.
Chemical Process Analyst
CAE Electronics Ltd.
e-mail: [log in to unmask]
-----Original Message-----
From: Brian Ellis [mailto:[log in to unmask]]
Sent: August 28, 2000 11:01 AM
To: [log in to unmask]
Subject: Re: [TN] Bubbles in through holes
Franklin
Rarely have I seen such an example of blowholing! You should patent your
process for
reducing the amount of lead in an assembly :-). Your board has simply
absorbed a lot of
moisture. A prebake will mitigate the problem, but prevention is better than
cure.
Brian
Franklin D Asbell wrote:
> Help...
>
> A customer has brought a problem to our attention. The yare experiencing
> 'air bubbles' in through holes after wave soldering.
>
> The copper plating in the hole is averaging 1.25 mils, we have not seen
> any compromised hole walls, only bubbles, they even extend up and out of
> the hole next to the component leads.
>
> I have uploaded pictures on our website, any assistance would be
> appreciated.
>
> These boards were fabricated here in Texas 13 months ago, the customer
> did not bake the boards prior to processing. Thanks
>
> You can view these pictures at this link:
> http://www.networkcircuits.com/technical.htm
>
> Franklin D Asbell
> Network Circuits, Inc.
> Irving, Texas 75061
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