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August 2000

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From:
"Houston, Terri" <[log in to unmask]>
Date:
Mon, 21 Aug 2000 13:49:37 -0500
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, "Houston, Terri" <[log in to unmask]>
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text/plain (24 lines)
Hi folks,
  I'm looking for information from someone with experience in using thermal
pads (sil-pads) with QFPs having a heatsink located on the underside of the
component. I can't seem to find pads of the right thickness to fill this
gap, so I'm assuming that the rest of the world was dispensing thermal
compounds on the boards for these types of packages.

Thanks,
Terri

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