Hi guys,
Just want to ask advice on what else to do on the unsoldered joints we
are encountering regarding one vendor of the chip capacitor.
We were using other vendors at that time then we used this one and it
caused us a lot of headache. Same SMT machine settings, same solder
paste, same ambient temperature and humidity. But using the new
capacitor with the said vendor, we already had a problem on unsoldered
joint.
     Does this mean that the solder paste we are using is not compatible
with the component termination???
     What we are doing right now is to drop a small amount of flux on
the affected locations before processing it in the reflow.
     What advice can you still give me??? We are doing all what we can
and yet, still the occurrence of unsoldered joints.

Regards,
Bing

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