In a message dated 08/11/0 1:12:59, Ed Popielarski writes:
>Seems "bumping" the thermal mass with the chip wave followed by the
>"equillibrium time" in transit to the smooth wave was enough of a boost
>toovercome the ground plane sink effect.
In a message dated 08/11/0 1:12:59, [log in to unmask] writes:
>True, works up to an extend, nasty way to treat cold barrels (Werner must
>have an opinion on this),
Hi Paul and All,
Actually, this is less bad than the typical reflow, because the total thermal
expansion of the resin is still likely less in this wave process than in
reflow--and T-shock has no special effect on PTHs. Also, since your fill the
via with solder, you would never know whether you cracked a barrel.
Werner Engelmaier

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