Good point: the rheology of solder pastes and adhesives can be severely effected by big
temperature excursions. Out times can also be reduced by high humidifies, some formulations of
WS pastes are quite vulnerable in this respect.

Mike


----- Original Message -----
From: "Ryan Grant" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, July 10, 2000 9:34 PM
Subject: Re: [TN] Manufacturing Floor Temperature...


> Besides all the things others have mentioned, watch out for what your solder
> paste will do.  Some solder paste will "melt" at 28 C, and you'll get a
> gooey mess at the screen printer.  Other solder pastes will work on boards
> that are so hot you will burn your hands to touch them.
>
> By the way, on some of our screen printers, the inside operating temperature
> is 27 C even though the ambient air temp is 23 C.  This means there is no
> room for error (i.e. a failed HVAC) with some solder pastes.
>
> Thanks
>
> Ryan Grant
> Advanced Technology Engineer
> MCMS
> (208) 898-1145
> [log in to unmask]
>
>
> > -----Original Message-----
> > From: Stephen R. Gregory [SMTP:[log in to unmask]]
> > Sent: Monday, July 10, 2000 11:28 AM
> > To:   [log in to unmask]
> > Subject:      [TN] Manufacturing Floor Temperature...
> >
> > Hi ya'll!!
> >
> > Seeing how summer is here (boy is it ever here in the midwest!!), what is
> > the
> > maximum temperature you would not exceed on the floor? I know the
> > J-STD-001C
> > calls out that the temperature should be maintained between 18-30 C.
> > (64.4-80
> > F.), and the humidity should not exceed 70%.

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