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July 2000

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Subject:
From:
Ken Fong <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 3 Jul 2000 10:40:58 +0800
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text/plain
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text/plain (25 lines)
Technetters,

Good days! In IPC-SM-782, the sizes of toe and heel fillets of common SMD
component terminations are given, but there's no explanation regarding how to
arrive at these figures. Is there any standards or guidelines on that? The
reason I ask this is that I often have to design surface mount solder lands for
many non-standard components? Thanks in advance.

Regards,
KenF, Jul 3,00

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