Good day Technet!  This email is guaranteed 100% spam free, virus free, will not cause warts, and can be deleted at your convenience!

Seriously though.  We are looking at an application using a ceramic BGA (429 balls, 1.27 mm pitch), in a high reliability, harsh environment application (in a vehicle).

I have two questions:
1) on FR4, say an 8 layer board, will I need an underfill for this application?

2) the IC's manufacturer is using balls made of 46% Sn, 46% Pb, 8% Bi.  Why this alloy, and are there any precautions I should know building with this?

Thanks all!
 

regards

Graham Collins
Process Engineer, Litton Systems Canada, Atlantic Facility
(902) 873-2000 ext 6215

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