CALL FOR PAPERS:
Fifth Annual IPC National Conference on Organic High Density Interconnect Structures (HDIS), "Solutions for Ultra-High Density PWBs"
November 9-10, 2000 - Tampa Marriott Waterside Hotel - Tampa, Florida
(With Workshops on November 8, 2000)

PAPER TOPICS:
Papers are sought in all areas of HDIS. Specifically, presentations from users that "make the case" for HDIS will be followed by presentations on manufacturing, design and material options. 

Papers should fall into one of five main areas:
1.  HDI Case Studies - examples of HDI projects; benchmarking of HDI products; current and future application of HDI and microvia technologies; market size and forecast; the influence of component packaging technologies on PWBs.
2.  Advanced PWB and HDI Fabrication - "Build-up" and microvia board technologies; hole metalization; blind and buried via processes; photolithography or registration; high volume manufacturing considerations.
3.  Equipment & Materials - New photo dielectrics; microvia metalization materials; lamination materials for sequential build-up; co-lamination materials; conductive ink/paste technologies; tooling procedures; new photo resists for fine line processing; alternative surface finishes.
4.  Advanced HDI Design - "Build-up" and microvia board design technology; blind and buried via design processes; HDI design tools; examples of HDI designs.
5.  HDI Reliability  - "Build-up" and microvia board reliability studies; failure mechanisms; Flip Chip/HDI performance; CSP / BGA / HDI reliability.

TO SUBMIT A PAPER:
To submit a paper, please provide a title, a 200-word abstract, a brief biography, and complete contact information (name, company, address, phone/fax, e-mail). Indicate whether your presentation is (a) introductory or (b) advanced/complex, and provide a recommended time allotment (30 or 45 minutes) for the paper presentation at the conference. Complete the attached form and either fax abstracts to John Riley at 847/509-9798 or e-mail to [log in to unmask]  The call for paper can also be downloaded from www.ipc.org. The deadline for abstract submission is August 20, 2000.

PRESENTATIONS:
Accepted submissions will be notified. Final presentations are due October 10, 2000. It is mandatory to provide a print-quality paper and/or hard copies of visuals in order to deliver an oral presentation.  All presentations must be non-commercial in nature. Speakers at the conference will receive full conference admission, including refreshments, lunches, and the conference proceedings at no charge. 

The deadline for abstract submission is August 20, 2000.