no sweat.

Unless the component is made out of alumina or has a heatsink slug, it will
easily stay on the board by surface tension alone.  (I have never seen a
TSOP made out of alumina or with a heat sink.  But never say never!)

Thanks

Ryan Grant
Advanced Technology Engineer
MCMS
(208) 898-1145
[log in to unmask]


> -----Original Message-----
> From: Justin Braime [SMTP:[log in to unmask]]
> Sent: Thursday, July 06, 2000 4:03 PM
> To:   [log in to unmask]
> Subject:      [TN] Component weights for double-sided reflow
>
> Hi All,
> Can anybody tell me if it is possible to perform double-sided reflow with
> TSOP 28T or 32T components on the bottom-side?
> I could work it out myself if I could only find the component weights!
> The prouct is at the design stage, so I don't have any components I can
> weigh :-(
>
> Thanks in advance!
>
> Justin Braime
> Compuspec Industries Ltd
> Auckland, New Zealand
>

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