We require our Reflow ovens to be calibrated and more importantly, to be under process control.

Currently we use a thermal profiler to check the oven and use the profiler to determine the profile for each type of board put through.

What is the best way to ensure that the oven will produce good results with the minimum of fuss.

I understand that a our profiler which thermocouples are soldered to the board, does give an indication what the PCB is subjected to.
The other method is to have thermocouples connected to the oven but it does not give a true indication what is happening to the PCB,

Can anybody help.

Regards,

Mick

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