Hi guys... I've been doing some Immersion White Tin research and was given a
link to a technical resource...thought I would pass it on.

http://www.floridacirtech.com/pdfs/omikronmarket.pdf

http://www.floridacirtech.com/pdfs/omikrontest.pdf

If you haven't read these two .pdf files... I would recommend them to you
highly...Gives technical test results from Florida CirTech and Parlex and
Trace Labs.... and details of their sales pitch.... :)
Good reading... and informative. It even discusses Lead Free and compares
Immersion Tin, NI/AU, Silver, HASL and OSP....ionic contamination levels,
accelerated thermal stress testing, rework, tin depletion with temp and
time, finish wetting, electromigration and dendritic growth...


Bill Brooks
Senior PCB Designer - [log in to unmask] <mailto:[log in to unmask]>

Zoneworx, Inc.
40925 County Center Drive, STE 200
Temecula, CA 92591
http://www.zoneworx.com    <http://www.zoneworx.com>
Tel: (909) 296-1226 x 1037
Co-Director / Education Officer / Webmaster
for the San Diego Chapter of the IPC Designers Council
http://www.ipc.org/SanDiego/index.html
<http://www.ipc.org/SanDiego/index.html>







-----Original Message-----
From: Darrel Therriault [mailto:[log in to unmask]]
Sent: Monday, July 31, 2000 2:46 PM
To: [log in to unmask]
Subject: Re: [TN] Subj: White Tin


Ron,

Can you share what IWT you are using??  I would also be interested in the
results of your
analysis, if you care to share that data as well.

Tks....DT



At 04:13 PM 7/31/00 -0500, you wrote:
>Hello TechNet:
>We performed some experiments on Immersion White Tin boards and found the
>following . . . .  First, we had no problems with solder paste application.
<snip>

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