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July 2000

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Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 31 Jul 2000 19:15:52 EDT
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In a message dated 7/31/00 6:01:32 PM EST, [log in to unmask] writes:

<< I like Gary's,
 apart from that,
 considering the heat loss and gold's relative resistance to wetting,
 it will help you to fill the barrel .
 True, with foam wicking heaps of flux up,
 you should be able to make it without tin, if you'd have less than 1um Au:
 I wouldn' even push it to 2um, on connectors.

 With heavy plate as you imagine you fracture the intermetalic,
 often magnified by the dry character of uneven heat.
 Agree, does not look like a big deal ,
 but con's caught me up few times .
 Sounds like the ALWAYS has had a very REAL reason, down in obscure past.
 But Au specs DID change a lot last decade :

 Your 30 of millionths of an inch convert according to my maths to
 some 0.76 micrometre, unless I messed it up as usual;
 than Gary's quote would not apply;
 than the short answer would be

 NOT REALLY, Steve, give it a shot

 paul >>

Hi again!

I haven't got the exact spec yet on these connectors (they're actually right
angle headers with a keying shroud), but the spec on plating thickness was
actually called out for the mating surfaces. The whole thing looks gold
plated, so I'm assuming that the gold thickness is consistent over the whole
thing...they don't plate one thickness on the mating surfaces and another on
the soldered portion do they?

Left a message with FCI's technical guys...still waiting to hear back from
them.

-Steve Gregory-

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