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July 2000

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Subject:
From:
Ruby Hazen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 31 Jul 2000 15:47:39 PDT
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Hello all:

We're using Coffin-Manson equation to calculate the acceleration factor
(AF)of solder joint. The failure mechanism is thermal fatigue. The only
stress taken into account in the equation is temperature range. I have a
question: is it possible to include the temperature transition rate in that
equation? And what's the relationship between AF and temperature rate?

Thanks a lot!

Ruby
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